|
Existing digital microchips have in-built mechanisms that allow the devices to handle and interpret the "on and off" signals that equate to binary code, the basic instructions for computers. Analogue chips, however, collect different types of information, such as radio waves, and convert those signals into digital information.
Many wireless devices, including most mobile phones, require both analogue circuits and digital chips in order to function. Intel's new manufacturing process, which aims to bear fruit in late 2003 or early 2004, could combine both digital and analogue capabilities in a single chip.
Such a combination would doubtlessly enhance the performance of most wireless devices and would dramatically affect the price of these tools and the local networks they run on.
Most of the details of the process are not yet available, but so far it is understood the company will use silicon-geranium transistors and mixed-signal circuitry to create the multi-functional processors. In 1998 IBM made bold in-roads in this integrated process by becoming one of the first companies to blend conventional silicon with germanium, which is highly suitable for high-frequency radio communications chips.
Previously, most digital computing technologies were integrated onto single silicon chips, and separate units performed analogue tasks. These analogue components were also relatively costly and rather large.
From a business perspective, Intel's new process could spell trouble for communications chipmakers such as Broadcom, Intersil, LSI Logic, Altera Corp and a few others. These companies have long watched Intel move closer and closer to the mobile computing and wireless space. Already, Intel is the number one maker of flash memory, often used in mobile phones. The company also has a growing networking and communications division and has shown a particular interest in 802.11 networking technologies.
The new process will also incorporate Intel's new integration process, announced last month, which is capable of drawing circuitry as fine as 90 nanometres, or about 1/1,000th the width of a human hair.
Reports say that Intel will use chips created with the new process in optical communications networking equipment. The company is also expected to incorporate them into 802.11-enabled devices.
|
